A novel subsurface damage model in diamond wire sawing of silicon wafers
Huapan Xiao, Shenxin Yin, Chi Fai Cheung, Piao Zhou
Topics & Concepts
WaferMaterials scienceDiamondSiliconComposite materialOptoelectronicsMetallurgyForensic engineeringMechanical engineeringEngineering physicsEngineeringAdvanced Surface Polishing TechniquesTunneling and Rock MechanicsAdvanced machining processes and optimization