3D boron nitride foam filled epoxy composites with significantly enhanced thermal conductivity by a facial and scalable approach
Xinwei Xu, Renchao Hu, Meiyu Chen, Jiufeng Dong, Bin Xiao, Qing Wang, Hong Wang
Topics & Concepts
Thermal conductivityMaterials scienceComposite materialEpoxyBoron nitrideDielectricMicroelectronicsPolymerThermal conductionNanotechnologyOptoelectronicsThermal properties of materialsDielectric materials and actuatorsFerroelectric and Piezoelectric Materials