TiB2-modified PDC electrical solder joints for electrical interconnection in extreme environments
Chao Wu, Fan Lin, Xiaochuan Pan, Yingping He, Guochun Chen, Zaifu Cui, Xianlong Liu, Daoheng Sun, Zhenyin Hai
Topics & Concepts
SolderingMaterials scienceInterconnectionCeramicJoint (building)Temperature cyclingComposite materialElectrical contactsElectrical resistance and conductanceContact resistanceSemiconductorMetallurgyThermalOptoelectronicsLayer (electronics)Structural engineeringComputer sciencePhysicsEngineeringComputer networkMeteorologyElectronic Packaging and Soldering TechnologiesAdvanced ceramic materials synthesis3D IC and TSV technologies