An Engineered Heterostructured Trinity Enables Fire-Safe, Thermally Conductive Polymer Nanocomposite Films with Low Dielectric Loss
Qiang Chen, Jiabing Feng, Yijiao Xue, Siqi Huo, Toan Dinh, Hang Xu, Yongqian Shi, Jiefeng Gao, Long‐Cheng Tang, Guobo Huang, Weiwei Lei, Pingan Song
Abstract
Abstract To adapt to the trend of increasing miniaturization and high integration of microelectronic equipments, there is a high demand for multifunctional thermally conductive (TC) polymeric films combining excellent flame retardancy and low dielectric constant ( ε ). To date, there have been few successes that achieve such a performance portfolio in polymer films due to their different and even mutually exclusive governing mechanisms. Herein, we propose a trinity strategy for creating a rationally engineered heterostructure nanoadditive (FG@CuP@ZTC) by in situ self-assembly immobilization of copper-phenyl phosphonate (CuP) and zinc-3, 5-diamino-1,2,4-triazole complex (ZTC) onto the fluorinated graphene (FG) surface. Benefiting from the synergistic effects of FG, CuP, and ZTC and the bionic lay-by-lay (LBL) strategy, the as-fabricated waterborne polyurethane (WPU) nanocomposite film with 30 wt% FG@CuP@ZTC exhibits a 55.6% improvement in limiting oxygen index (LOI), 66.0% and 40.5% reductions in peak heat release rate and total heat release, respectively, and 93.3% increase in tensile strength relative to pure WPU film due to the synergistic effects between FG, CuP, and ZTC. Moreover, the WPU nanocomposite film presents a high thermal conductivity ( λ ) of 12.7 W m −1 K −1 and a low ε of 2.92 at 10 6 Hz. This work provides a commercially viable rational design strategy to develop high-performance multifunctional polymer nanocomposite films, which hold great potential as advanced polymeric thermal dissipators for high-power-density microelectronics.