Life cycle impact assessment of semiconductor packaging technologies with emphasis on ball grid array
Chien-Hung Kuo, Allen H. Hu, Lance Hongwei Hung, Kuei-Tzu Yang, Chen-Hua Wu
Topics & Concepts
Ball grid arrayIntegrated circuit packagingLead frameGridParametric statisticsElectronic packagingReliability engineeringManufacturing engineeringComputer scienceEngineeringMechanical engineeringProcess engineeringSemiconductor deviceChipElectronic engineeringMaterials scienceTelecommunicationsNanotechnologyMathematicsLayer (electronics)SolderingComposite materialStatisticsGeometryEnvironmental Impact and SustainabilityRecycling and Waste Management TechniquesSustainable Supply Chain Management