Improvements of microstructure and hardness of lead-free solders doped with Mo nanoparticles
Linmei Yang, Shiran Ma, Guowan Mu
Topics & Concepts
MicrostructureMaterials scienceNanoparticleComposite numberDopingMetallurgyLead (geology)Composite materialNanotechnologyGeomorphologyOptoelectronicsGeologyElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesMetallurgical and Alloy Processes