Effect of radial grooves pads on copper chemical mechanical polishing
Chulwoo Bae, Shinil Oh, Juhwan Kim, Donggeon Kwak, Seungjun Oh, Taesung Kim
Topics & Concepts
Chemical-mechanical planarizationSlurryMaterials scienceRotational speedCopperWaferComposite materialHead (geology)OutflowMass fractionGroove (engineering)PolishingMetallurgyAnalytical Chemistry (journal)ChemistryChromatographyMechanical engineeringNanotechnologyMeteorologyPhysicsEngineeringGeologyGeomorphologyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationIntegrated Circuits and Semiconductor Failure Analysis