Revealing effects of common nonmetallic impurities on the stability and strength of Cu–Sn solder joints: A first-principles investigation
Ancang Yang, Kunxuan Xiao, Yonghua Duan, Caiju Li, Mingjun Peng, Li Shen
Topics & Concepts
Materials scienceSolderingDopingImpurityAtom (system on chip)Ultimate tensile strengthMetalOctahedronAdhesionAlloyCrystallographyComposite materialMetallurgyChemistryCrystal structureOptoelectronicsComputer scienceEmbedded systemOrganic chemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties