Development of a novel wet cleaning solution for Post-CMP SiO2 and Si3N4 films
Jung-Hwan Song, Ki‐Hong Park, Sanghuck Jeon, Jae‐Won Lee, Taesung Kim
Topics & Concepts
Materials scienceTetramethylammonium hydroxideChemical engineeringNanoparticleWettingChemical-mechanical planarizationWet cleaningSurface roughnessContact angleResidue (chemistry)NanotechnologyComposite materialOrganic chemistryChemistryLayer (electronics)EngineeringAdvanced Surface Polishing TechniquesSemiconductor materials and devicesElectronic and Structural Properties of Oxides