Scalable assembly of micron boron nitride into high-temperature-resistant insulating papers with superior thermal conductivity
Meng-Xin Liu, Rui‐Yu Ma, Zhixing Wang, Zhuoyang Li, Guilin Song, Jie Lin, Xinyuan Li, Ling Xu, Ding‐Xiang Yan, Li‐Chuan Jia, Zhong‐Ming Li
Abstract
and an excellent thermostability with an initial decomposition temperature of 486 °C. This outstanding comprehensive performance demonstrates the promise of applying these m-BN@ANF papers in advanced electrical systems operating under high-temperature circumstances.
Topics & Concepts
MiniaturizationMaterials scienceBoron nitrideThermal conductivityReliability (semiconductor)NitrideOptoelectronicsNanotechnologyThermalScalabilityEngineering physicsComposite materialPower (physics)Computer scienceEngineeringDatabasePhysicsQuantum mechanicsLayer (electronics)MeteorologyHigh voltage insulation and dielectric phenomenaThermal properties of materialsPower Transformer Diagnostics and Insulation