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2D materials readiness for the transistor performance breakthrough

Qing Zhang, Chunsen Liu, Peng Zhou

2023iScience24 citationsDOIOpen Access PDF

Abstract

As the size of the transistor scales down, this strategy has confronted challenges because of the fundamental limits of silicon materials. Besides, more and more energy and time are consumed by the data transmission out of transistor computing because of the speed mismatching between the computing and memory. To meet the energy efficiency demands of big data computing, the transistor should have a smaller feature size and store data faster to overcome the energy burden of computing and data transfer. Electron transport in two-dimensional (2D) materials is constrained within a 2D plane and different materials are assembled by the van der Waals force. Owning to the atomic thickness and dangling-bond-free surface, 2D materials have demonstrated advantages in transistor scaling-down and heterogeneous structure innovation. In this review, from the performance breakthrough of 2D transistors, we discuss the opportunities, progress and challenges of 2D materials in transistor applications.

Topics & Concepts

TransistorBenchmark (surveying)Dangling bondNanotechnologyComputer scienceMaterials scienceSiliconOptoelectronicsElectrical engineeringEngineeringGeodesyGeographyVoltage2D Materials and ApplicationsFerroelectric and Negative Capacitance DevicesGraphene research and applications
2D materials readiness for the transistor performance breakthrough | Litcius