Particle size dependence of nanoclustered ceria abrasives on surface activity and chemical mechanical planarization performance
Na‐Yeon Kim, Uiseok Hwang, Jaeuk Sung, Inkyung Park, Taesung Kim, Jonghwan Suhr, Jae‐Do Nam
Topics & Concepts
Chemical-mechanical planarizationMaterials scienceWaferParticle sizeSlurryAbrasiveCrystallinityAbrasive machiningCerium oxideChemical engineeringNanoparticleOxideNanotechnologyParticle (ecology)CeriumComposite materialMetallurgyPolishingGeologyOceanographyEngineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchMinerals Flotation and Separation Techniques