Microstructural evolution and deformation behavior of an interstitial TRIP high-entropy alloy under dynamic loading
Zeyu You, Zihan Tang, Bin Wang, H.W. Zhang, Peng Li, Li Zhao, F.B. Chu, Hua Ding
Topics & Concepts
Materials scienceTwipUltimate tensile strengthCrystal twinningDeformation (meteorology)Deformation mechanismStacking-fault energyStrain rateComposite materialDigital image correlationAlloyMetallurgyMicrostructureHigh Entropy Alloys StudiesAdditive Manufacturing Materials and ProcessesHigh-Temperature Coating Behaviors