Improvement of trade-off between mechanical properties and dielectric of polyimide with surface modified silica nanoparticle for wafer level packaging
Jinsu Kim, Seung‐Ho Baek, Juheon Lee, Sangrae Lee, Chanjae Ahn, Jinyoung Kim, Haksoo Han
Topics & Concepts
Materials sciencePolyimideDielectricPassivationComposite materialWaferPolymerNanoparticleSurface modificationLayer (electronics)Chemical engineeringNanotechnologyOptoelectronicsEngineeringSynthesis and properties of polymersSilicone and Siloxane ChemistryEpoxy Resin Curing Processes