Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing
Siou-Han Hu, Ting-Chun Lin, Chin-Li Kao, Fei-Ya Huang, Yi-Yun Tsai, Shih-Chieh Hsiao, Jui‐Chao Kuo
Topics & Concepts
IntermetallicMaterials scienceSolderingMicrostructureScanning electron microscopeNanoindentationMetallurgyBismuthElectron backscatter diffractionWettingEnergy-dispersive X-ray spectroscopyComposite materialAlloyElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesPowder Metallurgy Techniques and Materials