Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap
Kiwan Kim, Daeyoung Kong, Yunseo Kim, Bongho Jang, Jungwan Cho, Hyuk‐Jun Kwon, Hyoungsoon Lee
Topics & Concepts
Heat sinkMaterials scienceHeat transferHeat fluxPressure dropHeat transfer coefficientThermal resistanceNucleate boilingMechanical engineeringBoilingCritical heat fluxEnhanced heat transferMicroscale chemistryMicrochannelMechanicsThermodynamicsNanotechnologyEngineeringMathematics educationPhysicsMathematicsHeat Transfer and OptimizationHeat Transfer MechanismsHeat Transfer and Boiling Studies