Ultrasonic-assisted soldering of SiC ceramic and aluminum alloy with a commercial inactive Sn3.0Ag0.5Cu solder
Di Zhao, Chenchen Zhao, Ziyang Xiu, Jiuchun Yan
Topics & Concepts
SolderingMaterials scienceDissolutionCeramicSolder pasteAcoustic streamingMetallurgyCavitationUltrasonic sensorAlloyComposite materialChemical engineeringPhysicsAcousticsMechanicsEngineeringAdvanced ceramic materials synthesisElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties