A medium-temperature, metal-based, microencapsulated phase change material with a void for thermal expansion
Jiaming Bao, Deqiu Zou, Sixian Zhu, Qun Ma, Yinshuang Wang, HU Yun-ping
Topics & Concepts
Materials scienceThermal expansionVoid (composites)Scanning electron microscopeCoatingMicrostructureComposite materialDifferential scanning calorimetryThermalLayer (electronics)Phase-change materialThermodynamicsPhysicsPhase Change Materials ResearchAdsorption and Cooling SystemsSolar Thermal and Photovoltaic Systems