Research advances in the ultrasonic–assisting adhesive bonding
Zhengwu Zhou, Chao Chen
Topics & Concepts
Materials scienceAdhesiveUltrasonic sensorWettingComposite materialAdhesive bondingCapillary actionCuring (chemistry)Contact angleAcousticsLayer (electronics)PhysicsElectronic Packaging and Soldering TechnologiesMechanical Behavior of CompositesNanofabrication and Lithography Techniques