Recent Advances in W–Cu Composites: A Review on the Fabrication, Application, Property, Densification, and Strengthening Mechanism
Baoguang Zhang, Kun Yang, Zhifu Huang, Jian Wang
Abstract
Tungsten–copper (W–Cu) composite is a pseudoalloy prepared by powder metallurgy method with tungsten and copper as the main components, which are widely used in electrical contacts, electrical discharge machining electrodes, electronic packaging, aerospace, and military fields due to its good conductivity, thermal conductivity, high melting point, high electrical breakdown strength, low contact resistance, high welding resistance, and high heat resistance. Herein, the recent advances of W–Cu composites are reviewed systematically. First, the preparative techniques of W–Cu composites are introduced in detail, and their advantages and disadvantages are evaluated objectively. Second, an introduction of the main application fields and corresponding characteristics advantages for W–Cu composites are provided. Subsequently, the densification techniques and strengthening mechanisms and their effects on microstructure, mechanical properties, and physical properties of W–Cu composites are mainly discussed. Finally, based on a comprehensive review of W–Cu composites, its future development trends and potential research challenges are summarized and prospected.