Prediction of excess kerf loss in diamond wire sawing based on vibration source signal measurement and processing
Dameng Cheng, Yufei Gao, Wenbin Huang
Topics & Concepts
VibrationMaterials scienceWaferAccelerationSIGNAL (programming language)PerpendicularMonocrystalline siliconAcousticsExcitationDiamondEnhanced Data Rates for GSM EvolutionStructural engineeringDiamond turningSiliconAcoustic emissionQuality (philosophy)MachiningBeam (structure)Condition monitoringDiamond toolTunneling and Rock MechanicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimization