Litcius/Paper detail

Monitoring the curing process of epoxy adhesive using ultrasound and Lamb wave dispersion curves

Erwin Wojtczak, Magdalena Rucka

2020Mechanical Systems and Signal Processing28 citationsDOI

Topics & Concepts

AdhesiveMaterials scienceEpoxy adhesiveComposite materialCuring (chemistry)EpoxyUltrasonic sensorStiffnessAdhesive bondingStiffeningLayer (electronics)AcousticsPhysicsUltrasonics and Acoustic Wave PropagationThermography and Photoacoustic TechniquesAdvanced Fiber Optic Sensors