Competing failure modes in void and inclusion NiCoCrFeCu alloy under tensile simulation using molecular dynamic
Thi-Xuyen Bui, Yu-Sheng Lu, Te‐Hua Fang
Topics & Concepts
Materials scienceVoid (composites)Ultimate tensile strengthComposite materialStrain rateModulusTensile testingAlloyDeformation (meteorology)Microstructure and mechanical propertiesAdvanced materials and compositesHigh Temperature Alloys and Creep