Litcius/Paper detail

Grain size evaluation with time-frequency ultrasonic backscatter

Yangguang Bu, Xiling Liu, Joseph A. Turner, Yongfeng Song, Xiongbing Li

2020NDT & E International21 citationsDOI

Topics & Concepts

Backscatter (email)Ultrasonic sensorFrequency domainMaterials scienceAcousticsTime domainTransducerSensitivity (control systems)Sobol sequenceGrain sizeNoise (video)RepeatabilityElectronic engineeringMathematicsPhysicsStatisticsComputer scienceEngineeringTelecommunicationsComposite materialMathematical analysisWirelessImage (mathematics)Artificial intelligenceComputer visionUltrasonics and Acoustic Wave PropagationNon-Destructive Testing TechniquesGeophysical Methods and Applications
Grain size evaluation with time-frequency ultrasonic backscatter | Litcius