Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil
Yong Xiao, Zhipeng Song, Shan Li, Dan Li, Zhihao Zhang, Mingyu Li, Russell Goodall
Topics & Concepts
SolderingMaterials scienceMicrostructureComposite materialFOIL methodMetallurgyComposite numberAmorphous solidShear strength (soil)Joint (building)NanometreIntermetallicSolder pasteAlloyCrystallographyChemistryEnvironmental scienceEngineeringSoil scienceArchitectural engineeringSoil waterAluminum Alloy Microstructure PropertiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis