Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions
Ji‐Hoon Kang, Heechang Shin, Ki Seok Kim, Min‐Kyu Song, Doyoon Lee, Yuan Meng, Chanyeol Choi, Jun Min Suh, B. Kim, Hyunseok Kim, Anh Tuấn Hoàng, Bo‐In Park, Guanyu Zhou, Suresh Sundaram, Phuong Vuong, Jiho Shin, Jinyeong Choe, Zhihao Xu, Rehan Younas, Justin S. Kim, Sangmoon Han, Sangho Lee, Sun Ok Kim, Beomseok Kang, Seungju Seo, Hyojung Ahn, Seunghwan Seo, Kate Reidy, Eugene Park, Sungchul Mun, Min‐Chul Park, Suyoun Lee, Hyung-jun Kim, Hyun S. Kum, Peng Lin, Christopher L. Hinkle, A. Ougazzaden, Jong‐Hyun Ahn, Jeehwan Kim, Sang‐Hoon Bae, Jeehwan Kim, Sang‐Hoon Bae
Topics & Concepts
ElectronicsMaterials scienceEnhanced Data Rates for GSM EvolutionNanotechnologyComputer scienceEngineering physicsEngineeringElectrical engineeringTelecommunications2D Materials and ApplicationsMXene and MAX Phase MaterialsAdvanced Memory and Neural Computing