Screening of electroplating additive for improving throwing power of copper pyrophosphate bath via molecular dynamics simulation
Qingyang Li, Jiaping Hu, Jinqiu Zhang, Peixia Yang, Yidong Hu, Maozhong An
Topics & Concepts
PyrophosphateMolecular dynamicsCopperXylitolChemistryElectroplatingMaterials scienceMetallurgyNanotechnologyComputational chemistryBiochemistryFermentationEnzymeLayer (electronics)Electrodeposition and Electroless CoatingsCorrosion Behavior and InhibitionAnodic Oxide Films and Nanostructures