Effect of cold rolling on microstructure and mechanical properties of a Cu–Zn–Sn–Ni–Co–Si alloy for interconnecting devices
Zheshuai Zheng, Pushan Guo, Jiangang Li, Taisheng Yang, Zhenlun Song, Cheng Xu, Mingjiong Zhou
Topics & Concepts
MicrostructureMaterials scienceAlloyUltimate tensile strengthMetallurgyThermal stabilityTransmission electron microscopyOrthorhombic crystal systemElectrical resistivity and conductivityDislocationScanning electron microscopeComposite materialCrystallographyCrystal structureChemistryNanotechnologyEngineeringOrganic chemistryElectrical engineeringAluminum Alloys Composites PropertiesMicrostructure and mechanical propertiesSemiconductor materials and interfaces