The Removal Mechanism of Monocrystalline Si in the Process of Double Diamond Abrasive Polishing by Molecular Dynamics Simulation
Houfu Dai, Haixia Yue, Yang Hu, Ping Li
Topics & Concepts
PolishingAbrasiveMaterials scienceChemical-mechanical planarizationSurface roughnessDiamondWaferAbrasion (mechanical)Composite materialSurface finishMetallurgyNanotechnologyAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdvanced machining processes and optimization