High strength high conductivity copper prepared by C-ECAP and Cryo-rolling
Yang Gao, Tingbiao Guo, Ruicheng Feng, Danchen Qian, Dawei Huang, Guoqing Zhang, Dekui Ling, Yutian Ding
Topics & Concepts
Materials scienceCrystal twinningElectron backscatter diffractionBrassMicrostructureCopperUltimate tensile strengthMetallurgyTexture (cosmology)PressingSevere plastic deformationDeformation (meteorology)DiffractionComposite materialOpticsArtificial intelligenceImage (mathematics)Computer sciencePhysicsMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAdvanced materials and composites