Kinetics of voids evolution during diffusion bonding of dissimilar metals on consideration of the realistic surface morphology: Modeling and experiments
Ruijiang Chang, Qianying Guo, Zongqing Ma, Ran Ding, Chenxi Liu, Yongchang Liu
Topics & Concepts
Materials scienceVoid (composites)Surface roughnessSurface diffusionComposite materialSurface finishDiffusionShrinkageCreepMetallurgyThermodynamicsPhysical chemistryPhysicsChemistryAdsorptionAluminum Alloys Composites PropertiesAluminum Alloy Microstructure PropertiesIntermetallics and Advanced Alloy Properties