Synthesis of poly(ionic liquid) for trifunctional epoxy resin with simultaneously enhancing the toughness, thermal and dielectric performances
Bingyan Yin, Wenqing Xu, Chengjun Liu, Miqiu Kong, Yadong Lv, Yajiang Huang, Qi Yang, Guangxian Li
Abstract
), tensile modulus and strength are raised by 92.9%, 13.3% and 10.7%, respectively. Multi-toughening mechanisms due to spherical domains of PIL formed in TDE-85 during curing are responsible for the improved toughness. Moreover, the dielectric and thermal properties of TDE-85 are also enhanced by adding PIL. With the optimal addition of 5 wt% PIL, the dielectric constant of the composites is enhanced by 62.5%, the glass transition temperature is increased by 16.58 °C and the residual weight of carbon is increased by 59%.
Topics & Concepts
EpoxyIonic liquidMaterials scienceDielectricComposite materialThermalToughnessIonic bondingChemical engineeringPolymer chemistryIonChemistryOrganic chemistryCatalysisThermodynamicsOptoelectronicsEngineeringPhysicsEpoxy Resin Curing ProcessesSynthesis and properties of polymersPolymer Nanocomposites and Properties