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Thermal, microstructural, wettability and mechanical properties of Sn1.0Ag0.5Cu composite solder modified with Ti nanoparticles

Chuan-Jiang Wu, Liang Zhang, Chen Chen, Xiao Lu

2024Materials Characterization36 citationsDOI

Topics & Concepts

Materials scienceSolderingWettingMetallurgyMelting pointAlloyShear strength (soil)Composite materialIntermetallicMicrostructureElectron microprobeComposite numberEnvironmental scienceSoil waterSoil scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesInjection Molding Process and Properties
Thermal, microstructural, wettability and mechanical properties of Sn1.0Ag0.5Cu composite solder modified with Ti nanoparticles | Litcius