Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(<scp>iii</scp>)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent
Bo Wu, Baizhao Tan, Guizhen Tan, Ming Zeng, Jinyi Luo, Guanghui Hu, Jiye Luo, Zhifeng Hao, Shaomei Lai, Binyun Liu
Abstract
quantum chemical calculations. Therefore, our developed green cyanide-free electroless gold deposition process can beneficially provide research value and application prospects in microelectronic industry.
Topics & Concepts
HypophosphiteSodium hypophosphiteCorrosionPlating (geology)CyanideMaterials scienceDielectric spectroscopyMetallurgyX-ray photoelectron spectroscopyCoatingReducing agentLayer (electronics)ElectrochemistryInorganic chemistryChemistryNuclear chemistryChemical engineeringElectrodeNanotechnologyOrganic chemistryElectroplatingEngineeringGeologyGeophysicsPhysical chemistryElectrodeposition and Electroless CoatingsElectrocatalysts for Energy ConversionMolecular Junctions and Nanostructures