Evolution of microstructures and mechanical properties of ultrahigh strength, pure electrodeposited Cu during self-annealing
Chaerin Lee, Youjung Kim, Rosa Kim, Bongyoung Yoo, Jin-kyung Kim
Topics & Concepts
Materials scienceAnnealing (glass)ElectroplatingMicrostructureStacking-fault energyGrain boundaryUltimate tensile strengthCopperMetallurgyComposite materialGrain sizeGrain growthLayer (electronics)Microstructure and mechanical propertiesCopper Interconnects and ReliabilityElectrodeposition and Electroless Coatings