Epoxy composite with high thermal conductivity by constructing 3D-oriented carbon fiber and BN network structure
Ying Wang, Yuan Gao, Bo Tang, Xinfeng Wu, Jin Chen, Liming Shan, Kai Sun, Yuantao Zhao, Ke Yang, Jinhong Yu, Wenge Li
Abstract
As electronic devices tend to be integrated and high-powered, thermal conductivity is regarded as the crucial parameter of electronic components, which is the main factor that limits the operating speed and service lifetime of electronic devices.
Topics & Concepts
Materials scienceThermal conductivityEpoxyComposite materialBoron nitrideMicroelectronicsElectrical conductorComposite numberInterfacial thermal resistanceThermal conductionThermal resistanceThermalNanotechnologyMeteorologyPhysicsThermal properties of materialsThermal Radiation and Cooling TechnologiesTribology and Wear Analysis