Reliability and thermal fatigue life prediction of solder joints for advanced automotive microelectronics
Jiachen Gao, Jae B. Kwak
Topics & Concepts
Ball grid arrayAutomotive industryReliability (semiconductor)Component (thermodynamics)SolderingFlip chipMicroelectronicsElectronic componentAccelerated life testingAutomotive engineeringTemperature cyclingAutomotive electronicsReliability engineeringThermalMaterials scienceEngineeringMechanical engineeringWeibull distributionComposite materialElectrical engineeringLayer (electronics)Aerospace engineeringStatisticsQuantum mechanicsPower (physics)MathematicsMeteorologyThermodynamicsPhysicsAdhesiveElectronic Packaging and Soldering TechnologiesFatigue and fracture mechanicsAdvanced machining processes and optimization