Grain orientations and failure mechanism of isothermal aged nano Sn-3Ag-0.5Cu/Cu solder joints by microwave hybrid heating and shear mechanical strength
Shuai Zhang, Shuai Zhang, Hongzhi Zhou, Tianran Ding, Weimin Long, Sujuan Zhong, Kyung‐Wook Paik, Peng He, Shuye Zhang, Shuye Zhang
Topics & Concepts
Materials scienceSolderingComposite materialJoint (building)Shear (geology)WeldingElectron backscatter diffractionShear strength (soil)Grain sizeIsothermal processReflow solderingMicrostructureMetallurgyStructural engineeringSoil waterEngineeringEnvironmental scienceThermodynamicsPhysicsSoil scienceMicrowave-Assisted Synthesis and ApplicationsAdvanced materials and compositesElectronic Packaging and Soldering Technologies