Analysis of polishing waste ceramic foam packing in evaporative cooling
Ying Wang, Huang Xiang, Junjie Chu, Mingxun Qu, Tao Li, Cong Dai
Topics & Concepts
Evaporative coolerMaterials sciencePressure dropInletCeramicSphere packingHeat transferComposite materialAtomic packing factorAirflowMechanicsThermodynamicsMechanical engineeringChemistryCrystallographyPhysicsEngineeringAdsorption and Cooling SystemsSolar-Powered Water Purification MethodsHeat and Mass Transfer in Porous Media