Ultrathin flexible heat pipes with Microsorum fortunei structural-like wick for cooling flexible electronic devices
Yalong Sun, Fuye Liang, Heng Tang, Yong Tang, Shiwei Zhang, K.J. Chua
Topics & Concepts
Materials scienceThermal conductivityHeat transferComposite materialElectronicsFlexible electronicsBendingPorosityCasingMechanical engineeringOptoelectronicsThermodynamicsElectrical engineeringPhysicsEngineeringHeat Transfer and OptimizationHeat Transfer and Boiling StudiesPhase Change Materials Research