Microstructures and shear properties of antimony- and indium-strengthened Sn5Bi/Cu joints
Jiaheng Zhang, Yongheng Zhao, Xiaojing Wang, Shanshan Cai, Jubo Peng, Chen Liu, Mohamed Kallel, Zeinhom M. El‐Bahy, Shuai Wang, Baosheng Liu, Weibin Zhang, Cai Chen, Fengyi Guo, Yingxu Wang, Salah M. El‐Bahy
Topics & Concepts
Materials scienceMicrostructureAntimonySolderingDuctility (Earth science)Melting pointAlloySolid solutionIndiumPrecipitationShear (geology)MetallurgyShear strength (soil)Composite materialCreepPhysicsSoil scienceSoil waterEnvironmental scienceMeteorologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesSemiconductor materials and interfaces