The microencapsulation, thermal enhancement, and applications of medium and high‐melting temperature phase change materials: A review
Rizal Sinaga, Jo Darkwa, Siddig Omer, Mark Worall
Abstract
Microencapsulated phase change materials (MEPCMs) have made tremendous advancements in recent years, owing to their increased demand for a variety of energy storage applications. In this paper, current microencapsulation techniques, enhancement, and use of medium-and high-melting phase change materials (PCMs) are reviewed, as well as their potential benefits and limitations. The most frequently employed PCMs for medium-and high-temperature applications were recognized as salt-based, metallic, inorganic compound, and eutectic. Meanwhile, polymethyl methacrylate (PMMA), polystyrene-butylacrylate (PSBA), polyethyl-2-cyanoacrylate (PECA), and polyurethane were widely used as polymer shell materials for encapsulating medium-and high-melting point PCMs via chemical method, whereas inorganic silica shell was synthesized via various techniques.