Effect of anisotropy on 4H-SiC cracking behavior during diamond wire sawing
Hao Sun, Wenbo Bi, Mengran Ge, Peizhi Wang, Peiqi Ge, Peiqi Ge
Topics & Concepts
Materials scienceCrackingDiamondAnisotropyComposite materialMetallurgyStructural engineeringEngineeringOpticsPhysicsAdvanced Surface Polishing TechniquesSilicon Carbide Semiconductor TechnologiesDiamond and Carbon-based Materials Research