Litcius/Paper detail

Optimized selection of materials for IGBT module packaging

Omid Alavi, W. De Ceuninck, Michaël Daenen

2022Microelectronics Reliability11 citationsDOI

Topics & Concepts

Insulated-gate bipolar transistorFinite element methodMaterials scienceThermalReliability engineeringTOPSISMaterial selectionComputer scienceMechanical engineeringStructural engineeringComposite materialEngineeringElectrical engineeringPhysicsMeteorologyOperations researchVoltageSilicon Carbide Semiconductor TechnologiesAluminum Alloys Composites PropertiesInduction Heating and Inverter Technology
Optimized selection of materials for IGBT module packaging | Litcius