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Surface ion imprinted bagasse for selective removal of Cu (II) from the leaching solution of electroplating sludge

Junxia Yu, Hongxia Li, Ru-yi Zhou, Xiaodi Li, Hanjun Wu, Chunqiao Xiao, Ruan Chi

2022Colloids and Surfaces A Physicochemical and Engineering Aspects29 citationsDOI

Topics & Concepts

BagasseElectroplatingLeaching (pedology)Materials scienceMetallurgyPulp and paper industryChemical engineeringWaste managementChemistryEnvironmental scienceComposite materialEngineeringSoil scienceLayer (electronics)Soil waterAdsorption and biosorption for pollutant removalPhosphorus and nutrient managementRecycling and utilization of industrial and municipal waste in materials production
Surface ion imprinted bagasse for selective removal of Cu (II) from the leaching solution of electroplating sludge | Litcius