Effect of reinforced multiwall carbon nanotubes on the damping characteristics of Sn-Ag-Cu lead-free solder
Shih-Hang Chang, S.K. Wu, Chin Kuo
Topics & Concepts
Materials scienceSolderingCarbon nanotubeComposite materialActivation energyGrain boundaryCreepDislocationDiffusionReinforcementGrain sizeMetallurgyMicrostructureThermodynamicsOrganic chemistryChemistryPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties