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In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures

Huai-En Lin, Dinh-Phuc Tran, Wei-Lan Chiu, Hsiang‐Hung Chang, Chih Chen

2024Applied Surface Science24 citationsDOI

Topics & Concepts

Thermal expansionAnnealing (glass)Materials scienceIn situAtomic force microscopyCopperComposite materialModulusThermalMetallurgyNanotechnologyChemistryThermodynamicsPhysicsOrganic chemistryElectronic Packaging and Soldering TechnologiesMetal and Thin Film MechanicsForce Microscopy Techniques and Applications
In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures | Litcius