Shrinkage stress of thermal cured epoxy resin reduced by addition of functional hollow microspheres
Guanqing Sun, Lin Cheng, Mengyue Tong, Linlin Chen, Jing Luo, Ren Liu
Topics & Concepts
Materials scienceShrinkageEpoxyComposite materialGlass microsphereCoatingEmulsionCuring (chemistry)Stress (linguistics)MicrosphereChemical engineeringEngineeringLinguisticsPhilosophyPolymer composites and self-healingEpoxy Resin Curing ProcessesPhotopolymerization techniques and applications