The immiscible W/Cu composites with heterostructures and excellent bond strength prepared by additively manufactured transient liquid-phase direct bonding: Experiments and simulations
Zhangping Hu, Yanan Zhao, Xiaohong Zhan, Jiawei Xu, Zongqing Ma
Topics & Concepts
Materials scienceComposite materialTransient (computer programming)Phase (matter)Bond strengthLiquid phaseAdhesiveLayer (electronics)ThermodynamicsOrganic chemistryComputer scienceOperating systemPhysicsChemistryAdvanced materials and compositesAluminum Alloys Composites PropertiesElectronic Packaging and Soldering Technologies