Thermally Conductive Epoxy Resin Composites Based on 3D Graphene Nanosheet Networks for Electronic Package Heat Dissipation
Zhengyang Yan, Xiaoming Cai, Huiming Liang, Junwen Tang, Quan Gou, Wei‐Yao Wang, Yu Gao, Ming Qin, Honglin Tan, Jinming Cai
Abstract
With the development of 5G information technology, higher requirements are imposed on the heat dissipation performance of conventional polymer-based electronic packaging materials. Fabrication of an interconnected graphene nanosheet framework in polymers is an efficient method. However, current methods for the preparation of graphene nanosheet frameworks are typically complex and have low cross-linking densities. Herein, we prepared high-quality graphene nanosheet frameworks with high cross-link density. When the graphene content was merely 9 wt %, the in-plane thermal conductivity of the epoxy composites reached a high 18.8 W m –1 K –1, resulting in a thermal conductivity enhancement of 1034% per 1 wt % graphene loading, which is superior to most conventional graphene network structures used in polymer phonon pathways. This study provides a facile method to produce high cross-link density graphene nanosheet frameworks, which can inspire future development of graphene nanomaterials in the direction of heat dissipation in electronic packaging.